Method of manufacturing a semiconductor device with a gate electrode having a laminate structure

ABSTRACT

A semiconductor device includes a semiconductor substrate having a semiconductor layer, a gate electrode, a source region, a drain region, an element separation insulating film layer and a wiring. The gate electrode include a laminated structure having a gate insulating film formed on the semiconductor layer, a metal or a metallic compound formed on the gate insulating film and a polycrystalline silicon layer formed on the metal or metallic compound. The source region and drain region are formed on a surface portion of the semiconductor substrate and sandwich the gate electrode therebetween. The element separation insulating film layer surrounds the semiconductor layer. The wiring is in contact with the metal or metallic compound of the gate electrode.

This is a continuation of application Ser. No. 11/329,228, filed Jan.11, 2006 now U.S. Pat. No. 7,429,777, which is incorporated herein byreference.

This application is based upon and claims the benefit of priority fromthe Japanese Patent Application No. 2005-051355 filed on Feb. 25, 2005;the entire contents of which are incorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a semiconductor device and particularlyrelates to a CMIS device forming a silicon large scale-integratedcircuit to achieve high-grade information processing.

2. Description of the Related Art

Silicon large scale-integrated circuit is one of basic techniques forsupporting the future high-grade information-driven society. Highperformance of a CMIS device, which is a constituent element of anintegrated circuit, is required for making the function of theintegrated circuit high. Although performance of an element has beenfundamentally made high by a proportionally scaling rule, there is asituation where recent various physical limits have made it difficult toincrease performance based on the very fine structure of the element andoperate the element per se. One of difficulties is a problem that theeffective thickness of an insulating film is prevented from beingreduced due to depletion of a polycrystalline Si gate electrode.Although high performance of an MIS device has been achieved byreduction in thickness of a gate insulating film in accordance with theproportionally scaling rule, higher performance of the MIS device isbecoming difficult due to depletion of the polycrystalline Si gateelectrode. The depletion-layer capacitance of the polycrystalline Sigate electrode will reach about 30% of the capacitance of an oxide filmin a technical generation in which the thickness of the gate oxide filmis smaller than 1 nm.

The depletion-layer capacitance can be reduced when the polycrystallineSi gate electrode is replaced by a metal gate electrode. A large issuein use of the metal electrode in the MIS device is a gate processingtechnique. Technical development of an RIE process is required so newlythat metal can be processed with accuracy of the order of tens ofnanometers. Particularly in a CMIS device, two kinds of electrodematerials different in work function need to be used in accordance withthe conduction type in order to achieve an optimum threshold voltage.Development of processing techniques according to the materials isessential. This requirement brings complication in technical developmentand fabricating process, so that there is a situation where increase incost is unavoidable.

To avoid this problem, a polycrystalline Si/metal laminated gateelectrode structure having a thin metal layer introduced into only thelower portion of the gate electrode, and polycrystalline Si used on themetal layer has been proposed (e.g. a gate electrode structure of metal[lower layer] and polycrystalline Si [upper layer] has been described inU.S. Pat. No. 6,020,024). When this structure is used, theaforementioned problem of processing can be avoided or reduced so thatstress of the metal electrode at the time of heat treatment can berelaxed, and that the upper polycrystalline Si functions as an S/D ionimplantation stopper to prevent ions from being injected into thechannel. When this structure is applied to the gate electrode, a newdepletion layer is however generated in the polycrystalline Si/metalSchottky interface. Therefore, suppression of depletion of the gateelectrode, which is the original purpose of introduction of the metalgate, cannot be achieved.

SUMMARY OF THE INVENTION

In view of the circumstances set forth above, the invention has beenmade. Introduction of the metal gate electrode technique is essential tosuppression of depletion of the gate electrode, and a polycrystallineSi/metal laminated structure is advantageous from the point of view ofsimplification of the processing technique on this occasion. However,depletion of the polycrystalline Si/metal interface is unavoidable. Theinvention suppresses depletion of a polycrystalline Si/metal interfacewhile applying a polycrystalline Si/metal laminated structure to a gateelectrode.

According to one embodiment of the invention, a semiconductor deviceincludes a semiconductor substrate, a gate electrode, a gate insulatingfilm, a source region and a drain region, an element separationinsulating film layer and an upper wiring. The semiconductor substrateincludes a semiconductor layer. The gate electrode includes a laminatedstructure having a gate insulating film, a metal or a metallic compound,and polycrystalline silicon layer. The gate insulating film is formed onthe semiconductor layer. The metal or metallic compound is formed on theinsulating film. The polycrystalline silicon layer is formed on themetal or the metallic compound. The source region and drain region,which are formed on a surface portion of the semiconductor substrate,sandwich the gate electrode therebetween. The element separationinsulating film layer surrounds the semiconductor layer. The upperwiring is in contact with the metal or metallic compound of the gateelectrode.

According to this structure, the gate electrode in the MIS transistorformed on the semiconductor substrate forms a polycrystalline Si/metallaminated structure, and the contact portion with the upper wiring isformed so that the upper wiring reaches the metal layer, which is thelower layer of the gate laminated structure. In this manner, the upperpolycrystalline Si layer and the lower metal layer are kept in the sameelectrical potential. Therefore, depletion of the polycrystallineSi/metal interface can be suppressed.

As described above, according to one embodiment of the invention, in theMIS transistor formed on the semiconductor substrate, the gate electrodeforms a polycrystalline Si (upper layer)/metal (lower layer) laminatedstructure and the contact portion with the upper wiring is formed sothat the upper wiring reaches the metal layer, which is the lower layerof the gate laminated structure. In this manner, the upperpolycrystalline Si layer and the lower metal layer are kept in the samepotential. Accordingly, the electrical potential difference, whichcauses a problem of the polycrystalline Si/metal laminated gatestructure, is not generated between the polycrystalline Si and the lowermetal layer (TiN). Therefore, the depletion layer is not extended sothat a voltage equal to the voltage applied to the gate is applied tothe gate insulating film. Sufficient carrier can be formed in thechannel region, so that improvement in drive current can be obtained. Inaddition, because gate processing can be obtained as development of theexisting technique, fabrication of a semiconductor device having a metalgate electrode and technical development thereof can be simplified.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a semiconductor device according to the invention.

FIGS. 2A and 2B are energy band views of an Si substrate, a gateinsulating film layer, a metal layer and a polycrystalline Si layer inthe case where the metal layer is used as the lowermost layer while thepolycrystalline Si layer is used on the metal layer.

FIG. 3 shows a semiconductor device according to the invention.

FIGS. 4A to 4F show a method of fabricating a semiconductor deviceaccording to the invention.

FIG. 5 shows a semiconductor device according to the invention.

FIGS. 6A to 6C show a method of fabricating a semiconductor deviceaccording to the invention.

FIG. 7 shows a semiconductor device according to the invention.

FIG. 8 shows a semiconductor device according to the invention.

FIG. 9 shows the effective work function of each of metals and metalliccompounds.

FIG. 10 shows a semiconductor device according to the invention.

FIG. 11 shows TiN film thickness dependence of the effective workfunction of a polycrystalline Si/TiN thin film laminated gate electrode.

FIG. 12 shows a semiconductor device according to the invention.

DETAILED DESCRIPTION OF EMBODIMENTS OF THE INVENTION

Embodiments of the invention will be described in detail below withreference to the accompanying drawings.

Embodiment 1

FIG. 1 shows a semiconductor device according to a first embodiment ofthe invention.

A thermally oxidized silicon film layer 8 is formed as a gate insulatingfilm layer on a p-type semiconductor layer of a silicon substrate. Thethickness of the oxidized film 8 is preferably 2 nm or less. A gateelectrode 1 is formed on the gate insulating film layer 8. The gateelectrode 1 has a laminated structure, which includes a three-layerstructure in which a TiN layer 7, a polycrystalline Si layer 6 and aNiSi layer 5 are laminated successively when viewed from the gateinsulating film layer 8. The polycrystalline Si layer 6 is doped withhigh-concentration phosphorus. The film thicknesses of the three layersare preferably 10 nm, 50 nm and 10 nm respectively. The gate electrode 1is connected to an upper wiring through a W gate contact plug 3.

In U.S. Pat. No. 6,020,024, an upper wiring plug is connected only to asilicide layer, which is an upper portion of a gate electrode. Accordingto this embodiment of the invention, the structure of the gate contactportion is configured so that the W gate contact plug 3 of the upperwiring is connected to the gate electrode 1 in an element separationregion and passes through the NiSi layer 5 and the polycrystalline Silayer 6, which are an upper portion of the laminated structure of thegate electrode 1, so as to come into contact with the TiN layer 7, whichis a lower layer of the laminated structure. Although this embodimentshows the case where the upper wiring plug is made of W, a low-resistantmetal material such as Al, Cu, etc. may be used suitably. In this case,a TiN film or another barrier film may be used on an upper side of theTiN layer 7 in order to improve adherence between the W gate contactplug 3 and an Si oxide film layer (not shown), which is present in theperiphery of the W gate contact plug 3. Source-drain regions 10 areformed so that the laminated structure of the gate electrode and thegate insulating film layer 8 is sandwiched between the source-drainregions 10. A NiSi layer 5 for bringing an upper electrode and adiffusing layer into contact with each other is formed on each of thesource-drain regions 10. The film thickness of the NiSi layer 5 locatedon the diffusing layer is preferably equal to that on the gate portion.Thus, an n-type MIS transistor is fabricated on the p-type semiconductorlayer of the silicon substrate.

Although this embodiment shows the case where the lowermost layer of thegate electrode being in contact with the gate insulating film layer 8 ismade of TiN, a metal material having a work function according to athreshold voltage necessary for the technical generation and purpose ofeach device may be used. A semiconductor layer such as a polycrystallineSiGe layer, a Ge layer, an SiC layer, etc. may be used as anintermediate layer of the gate electrode structure. Besides NiSi, alayer of low-resistant metal silicide, germano-silicide, germanide orcarbide silicide may be used as the NiSi layer 5 located as theuppermost portion, in accordance with the semiconductor layer located asthe intermediate layer. A structure in which the whole of the diffusinglayer is replaced by metal, metal silicide or germanide, that is, aso-called Schottky type structure may be used as the structure of asource-drain region 2. In this case, a layer of rare earth metalrepresented by Er having a low Schottky barrier height with respect toelectrons or a layer of silicide of the rare earth metal may bepreferably used as the metal diffusing layer. A segregation Schottkystructure in which P or As of high concentration is segregated on ametal/Si interface by use of a snow-plow phenomenon at the time ofsiliciding reaction may be used in order to make the Schottky barrierlow effectively. A source-drain and contact structure necessary for eachgeneration may be used. Although this embodiment shows the case where asilicon oxide film is used as the gate insulating film layer 8, aninsulating film material (high dielectric insulating film) higher indielectric constant than the silicon oxide film may be used. Forexample, Si₃N₄, Al₂O₃, Ta₂O₅, TiO₂, La₂O₅, CeO₂, ZrO₂, HfO₂, SrTiO₃,Pr₂O₃, etc. may be used. A silicon oxide-metal ion mixture material suchas Zr silicate or Hf silicate may be used effectively or a combinationof silicon oxide-metal ion materials may be used. A high dielectricinsulating film-nitrogen mixture material such as HfSiON may be used. Inthis manner, heat resistance of the gate insulating film layer 8 isimproved to thereby make it easy to form the gate structure in afabricating process. Materials necessary for the transistor of eachgeneration can be selected suitably. Although the following embodimentswill show the case where the gate insulating film layer 8 is made of asilicon oxide film while the gate electrode 1 is made of polycrystallineSi, it is a matter of course that these materials may be replaced by ahigh dielectric insulating film and a metal material respectivelywithout particular notice. As for device structures other than the gateelectrode structure, a structure according to the purpose of the devicecan be used for each generation without departing from the gist of theinvention.

In the electrode structure in the embodiment shown in FIG. 1, the thinmetal layer (TiN layer 7) is used in the gate electrode 1 on a sideabutting against the gate insulating film layer 8. The thickpolycrystalline Si layer 6 is formed on the metal layer. The NiSi layer5 is formed on the polycrystalline Si layer 6 in order to reduce thesheet resistance of the electrode. Since the metal electrode is used atan interface with the gate insulating film layer 8, an interfacedepletion layer, which was formed in the case of using the typepolycrystalline Si gate electrode of U.S. Pat. No. 6,020,024, can beprevented from being formed. To increase the drive current of MISFET, itis necessary to make the gate capacitance high. This has been achievedby reduction in thickness of the gate insulating film layer 8.

Nowadays, a technique of a technical generation for reducing thethickness of the Si oxide film to be smaller than 1 nm is required. Insuch a situation, parasitic capacitance included in the gate capacitanceis making it difficult to increase the gate capacitance on the basis ofreduction in thickness of the gate insulating film layer 8. As for thegate capacitance, a component of depletion-layer capacitance of thepolycrystalline Si electrode is added in series to the capacitance ofthe gate insulating film. Because the solid solution limit of dopant inpolycrystalline Si of the electrode is about 2×10²⁰ cm⁻³ at the most,the depletion-layer capacitance is generated in accordance with thenecessity of depleting a finite length to invert the Si substrate sideand to block electric charges. The depletion-layer capacitance ispresent whenever the polycrystalline Si electrode is used. Thedepletion-layer capacitance reaches about 0.5 nm in terms of thethickness of the Si oxide film. Accordingly, the depletion-layercapacitance is a large factor of barrier in terms of the purpose ofincreasing gate capacitance by reducing thickness of the gate insulatingfilm layer. As a measure to solve this problem, a metal material can beused as the gate electrode material to reduce the depletion-layercapacitance. The electron screening length of the metal material isextremely smaller than that of polycrystalline Si, so that the gateelectrode 1 can be prevented from being depleted. Accordingly, thedepletion-layer capacitance, which is a component in series to thecapacitance of the gate insulating film, can be neglected, so thatincrease in gate capacitance can be brought. The same thing can be saidalso in the case where the gate insulating film layer 8 is replaced by ahigh-k material. This means that reduction in thickness of the gateinsulating film layer 8 effectively advances by 0.5 nm in terms of thethickness of the Si oxide film. According to semiconductor road map2003, when a metal electrode is used, the EOT required value can berelaxed compared with a polycrystalline Si electrode because thedepletion-layer capacitance can be neglected, so that a gate insulatingfilm layer 8 thick by about 0.7 nm in terms of the EOT required valuecan be applied. From this fact, the generation to introduce a high-kgate insulating film can be postponed, that is, the life of the existingSiON film can be elongated as long as the metal gate can be introducedearly. Moreover, specifications required for each technical generationcan be relaxed after introduction of the high-k gate insulating film, sothat the time of introduction of a direct junction type high-k film onwhich a problem of degradation of mobility etc. is severe and has notbeen solved yet can be postponed.

Because the purpose of the metal gate electrode is to suppress depletionof the interface as described above, the purpose of the metal gateelectrode can be achieved when a metal layer is introduced only into thevicinity of the interface with the gate insulating film layer 8 as inthe embodiment shown in FIG. 1. Details will be described in afabricating method later. In short, when the upper portion of the gateelectrode 1 is made of a polycrystalline Si layer 6 in the same manneras in the U.S. Pat. No. 6,020,024, a device having a metal gateelectrode can be fabricated easily. When such a structure is used, thereis however a problem of depletion of the polycrystalline Si/metalinterface as will be described below.

FIGS. 2A and 2B show views of energy bands of the Si substrate, the gateinsulating film layer 8, the metal layer and the polycrystalline Silayer 6 in the case where a metal layer, which is the lowermost layer asshown in FIG. 1, is used in the gate electrode 1 while thepolycrystalline Si layer 6 is used on the metal layer. FIG. 2A shows thecase of a contact structure in which the upper wiring reaches only theNiSi layer 5, which is the uppermost portion of the gate electrode 1. Inthis case, when a gate voltage is applied at the time of transistoroperation, the voltage is applied to the Schottky interface, which isthe polycrystalline Si/metal interface, so that a long depletion layeris formed in accordance with the gate voltage. In this case, the voltageapplied to the gate insulating film layer 8 is so insufficient thatsufficient carrier cannot be formed in the channel surface. Accordingly,high performance of the transistor based on the introduction of themetal electrode cannot be achieved. This is because use of the metalelectrode can eliminate the depletion layer from the gate electrode/gateinsulating film interface but forms a new depletion layer in thepolycrystalline Si/metal interface.

Therefore, as the gate contact structure of this embodiment shown inFIG. 1, there is used a structure in which the W plug of the upperwiring passes through the NiSi layer 5 and the polycrystalline Si layer6, which are located in the upper portion of the laminated structure ofthe gate electrode 1, so as to come into contact with the TiN layer 7located as the lower layer of the laminated structure. An energy bandview in this case is shown in FIG. 2B. In this case, all contactportions of the gate electrode 1 are short-circuited so as to be kept inthe same electrical potential. Accordingly, because there is nopotential difference between polycrystalline Si and metal (TiN) of thelower layer, the depletion layer is prevented from being extended.Accordingly, a voltage equal to the voltage applied to the gate isapplied to the gate insulating film layer 8, so that sufficient carriercan be formed in the channel region to obtain improvement in drivecurrent. Accordingly, the gate contact structure of the gate electrode 1and the upper wiring according to this embodiment permits thepolycrystalline Si/metal electrode laminated gate electrode structure tobe used for solving the problem. Although this embodiment relates to ann-type transistor formed on a p-type board, it is a matter of coursethat the invention can be applied to a p-type transistor formed on ann-type Si single crystal substrate or on a well.

FIGS. 4A to 4F are views for explaining a method of fabricating thesemiconductor device according to this embodiment as shown in FIG. 1.

Element separation is formed by a shallow trench method to separaterespective elements. The thermally oxidized silicon film 8 is formed ina surface of a p-type semiconductor layer of a silicon substrate in adevice-forming region thus separated.

Then, the TiN film 7 and the polycrystalline silicon layer 12 are formedsuccessively by CVD (FIG. 4A). Then, the polycrystalline Si layer 12,the TiN film 7 and the gate insulating film layer 8 are processed as agate electrode by lithography. The source-drain regions 10 of an n-typeMIS transistor are formed by implantation of arsenic ions. At the sametime, As is also injected into the polycrystalline Si layer 12 of thegate electrode.

Then, side walls (gate side wall Si oxide film layers 11) are formed forelectrically insulating the gate electrode 1 from the source-drainregions 10 (FIG. 4B). Then, Ni is sputtered to form an 8 nm-thick Nifilm (deposited nickel layer 13 in FIG. 4C) and heat treatment isperformed at 450° C. to form silicide only the upper portions of thegate electrode 1 and source-drain regions 10 to thereby form the NiSilayer 5 (FIG. 4D). Then, a BPSG film 14 is formed as a film betweenwiring layers of the upper wiring and CMP is performed to flatten asurface of the BPSG film 14. Then, an opening portion for a gate contactplug and opening portions for source-drain contact plugs are formed byphotolithography and RIE. On this occasion, the plugs are stopped atupper ends of the NiSi layers 5. Then, only the gate contact plug isexposed by photolithography and RIE and the opening portion for the gatecontact plug is excavated so as to reach the TiN film, which is thelower layer of the gate electrode (FIG. 4E). Then, W is embedded in eachcontact plug by CVD to thereby obtain a sectional structure shown in thefirst embodiment (FIG. 4F).

Embodiment 2

FIG. 3 shows a semiconductor device according to a second embodiment ofthe invention.

As will be described later, when the W gate contact plug 3 of the gateelectrode is excavated to an element separation insulating film layer 9so as to pass through the TiN layer 7 and the insulating film layerlocated below the TiN layer 7 in the step of excavating the W gatecontact plug 3 to the lower TiN layer, a structure shown in the secondembodiment is formed. When one and the same kind of metal element iscontained in both the metal layer located as the lower layer of the gateelectrode 1 and the insulating film, a vapor pressure difference is toosmall to ensure the selection ratio in RIE process. Accordingly, in thecase of a structure of HfN electrode/Hf oxide or Hf silicate, theexcavating of the contact plug up to the element separation insulatingfilm 9 facilitates the fabrication process.

Details will be described below. The thermally oxidized silicon film ofthe gate insulating film layer 8 is formed on the p-type semiconductorlayer of the silicon substrate. The thickness of the oxide-film ispreferably 2 nm or less. The gate electrode 1 is formed on the gateinsulating layer. The gate electrode 1 includes a laminated structurehaving a three-layer structure in which the TiN layer 7, thepolycrystalline Si layer 6 and the NiSi layer 5 are laminatedsuccessively when viewed from the gate insulating film layer 8. Thepolycrystalline Si layer 6 is doped with high-concentration phosphorus.The film thicknesses of the three layers are preferably 10 nm, 50 nm and10 nm, respectively. The gate electrode 1 is connected to an upperwiring through the W gate contact plug 3. The structure of the gatecontact portion is configured so that the W plug 3 of the upper wiringis connected to the gate electrode 1 in the element separation regionand passes through the laminated structure of the gate electrode 1 andthe gate insulating film layer 8 to come into contact with the elementseparation Si oxide film 9, which is the lower layer. Although thisembodiment shows the case where the upper wiring plug 3 is made of W, alow-resistant metal material such as Al or Cu may be used suitably. Inthis case, a TiN film may be used as a barrier film in order to improveadherence between a metal barrier layer and the Si oxide film.Source-drain regions 10, which are n-type high-density impurity regions,are formed on the p-type semiconductor layer of the silicon substrate tosandwich the laminated structure of the gate electrode 1 and the gateinsulating film layer 8 therebetween. The NiSi layer 5 is formed on eachof the source-drain regions 10 to bring the upper electrode and thediffusing layer into contact with each other. The film thickness of theNiSi layer 5 located on the diffusing layer is preferably equal to thefilm thickness of the NiSi layer 5 located on the gate portion. Thus, ann-type MIS transistor is formed on the p-type semiconductor layer of thesilicon substrate.

Although this embodiment shows the case where the lowermost layer of thegate electrode being contact with the gate insulating film layer 8 ismade of TiN, the lowermost layer may be made of a metal material havinga work function in accordance with a threshold voltage necessary for thetechnical generation and purpose of each device. A semiconductor layersuch as a SiGe layer, a Ge layer, a SiC layer, etc. may be used as anintermediate layer of the gate electrode structure. Besides NiSi, alayer of low-resistant metal silicide, germano-silicide, germanide orcarbide silicide may be used as the uppermost NiSi layer 5 in accordancewith the intermediate semiconductor layer. As for the other devicestructure than the gate electrode 1, a structure in accordance with thepurpose of the device may be used in each generation without departingfrom the gist of the invention. Although this embodiment relates to ann-type transistor formed on a p-type board, it is a matter of coursethat the second embodiment of the invention can be effectively appliedto a p-type transistor formed on an n-type Si single crystal substrateor on a well. In this embodiment, the W gate contact plug 3 reaches theelement separation Si oxide film 9, which is an element separation STI.The STI is made of a Si oxide film and very poor in heat conductivity.In a technical generation in which the number of elements on one chipreaches several hundred millions so that element density becomes highgreatly, there is a problem that heat is generated from the channelregion due to the operation of the device. In the structure according tothis embodiment, metal good in heat conductivity is embedded in the STIso that heat can be efficiently radiated to achieve both stability andspeed of the element operation simultaneously. Particularly in the caseof an SOI device shown in FIG. 12, the channel region is surrounded bythe STI and an embedded insulating film layer 22, so that there is asituation in which heat generated in the channel portion is hardlyradiated. When this embodiment is used for accelerating heat radiation,a stable device operation can be achieved.

Embodiment 3

FIG. 5 shows the semiconductor device according to a third embodiment ofthe invention.

A thermally oxidized silicon film is formed as a gate insulating filmlayer 8 on a p-type semiconductor layer of a silicon substrate. Thethickness of the oxide film is preferably 2 nm or less. A gate electrode1 is formed on the gate insulating film layer 8. The gate electrode 1includes a laminated structure having a three-layer structure in which aTiN layer 7, a polycrystalline Si layer 6 and an NiSi layer 5 arelaminated successively when viewed from the gate insulating film layer8. The polycrystalline Si layer 6 is doped with high-concentrationphosphorus. The film thicknesses of the three layers are preferably 10nm, 50 nm and 10 nm, respectively. The gate electrode 1 is connected toan upper wiring through a gate contact plug 3. The structure of the gatecontact portion is configured so that a NiSi film 5 is connected to theTiN film 7, and that the W gate contact plug 3 provided thereon is incontact with the NiSi layer 5.

Although this embodiment shows the case where the upper wiring plug 3 ismade of W, a low-resistant metal material such as Al or Cu may be usedsuitably. In this case, a TiN film may be used as a barrier film inorder to improve adherence between a metal barrier layer and the Sioxide film. Source-drain regions 10, which are n-type high-densityimpurity regions, are formed on the p-type semiconductor layer of thesilicon substrate to sandwich the laminated structure of the gateelectrode 1 and the gate insulating film layer 8 therebetween. A NiSilayer 5 is formed on each of the source-drain regions 10 to bring theupper electrode and the diffusing layer into contact with each other.The film thickness of the NiSi layer 5 located on the diffusing layer ispreferably equal to the film thickness of the NiSi layer 5 located onthe gate portion. W source-drain contacts 4 are connected to upperportions of the NiSi layers 5 located on the diffusing layers,respectively. Thus, an n-type MIS transistor is formed on the p-typesemiconductor layer of the silicon substrate. Although this embodimentshows the case where the lowermost layer of the gate electrode beingcontact with the gate insulating film layer 8 is made of TiN, thelowermost layer may be made of a metal material having a work functionin accordance with a threshold voltage necessary for the technicalgeneration and purpose of each device. A semiconductor layer such as aSiGe layer, a Ge layer, an SiC layer, etc. may be used as anintermediate layer of the gate electrode structure. Besides NiSi, alayer of low-resistant metal silicide, germano-silicide, germanide orcarbide silicide may be used as the uppermost NiSi layer 5 in accordancewith the intermediate semiconductor layer. As for the other devicestructure than the gate electrode 1, a structure in accordance with thepurpose of the device may be used in each generation without departingfrom the gist of the invention. Although this embodiment relates to ann-type transistor formed on a p-type board, it is a matter of coursethat the third embodiment of the invention can be effectively applied toa p-type transistor formed on an n-type Si single crystal substrate oron a well.

FIGS. 6A to 6C are views for explaining a method of fabricating asemiconductor device according to the third embodiment of the inventionas shown in FIG. 5.

Element separation is formed by a shallow trench method to separaterespective elements. A thermally oxidized silicon film is formed in asurface of a p-type semiconductor layer of a silicon substrate in thedevice-forming region thus separated. Then, a TiN film and apolycrystalline silicon layer are formed successively by CVD. Then, thegate electrode 1 and the gate insulating film layer 8 are processed bylithography. Source-drain regions 10 of an n-type MIS transistor areformed by implantation of arsenic ions. At the same time, As is alsoinjected into the polycrystalline Si of the gate electrode 1. Then, sidewalls (gate side wall Si oxide film layers 11) are formed forelectrically insulating the gate electrode 1 from the source-drainregions 10. Then, Ni is sputtered to form an 8 nm-thick Ni film and heattreatment is performed at 450° C. to form silicide only the upperportions of the gate electrode 1 and the source-drain regions 10 tothereby form an NiSi layer 5 (FIG. 6A). Then, a BPSG film 14 is formedas a film between wiring layers of the upper wiring and CMP is performedto flatten a surface of the BPSG film 14.

Then, an opening portion for a gate contact plug and opening portionsfor source-drain contact plugs are formed by photolithography and RIE(not shown). On this occasion, the plugs are stopped at upper ends ofthe NiSi layers 5. Then, only the gate contact plug is exposed byphotolithography and RIE and Ni is sputtered to form a 20 nm-thick Nifilm (FIG. 6B). Then, heat treatment is performed at 450° C. to therebyfully silicide (NiSi) the polycrystalline Si of the gate electrode 1 inthe W gate contact plug opening portion. Finally, W is embedded in eachcontact plug by CVD to thereby obtain a sectional structure of the thirdembodiment (FIG. 6C).

Embodiment 4

FIG. 7 shows the semiconductor device according to a fourth embodimentof the invention.

A thermally oxidized silicon film is formed as a gate insulating filmlayer 8 on a p-type semiconductor layer of a silicon substrate. Thethickness of the oxide film is preferably 2 nm or less. A gate electrodeis formed on the gate insulating film layer 8. The gate electrodeincludes a laminated structure having a four-layer structure in which anLaB₆ layer 18, a TiN layer 7, a polycrystalline Si layer 6 and an NiSilayer 5 are laminated successively when viewed from the gate insulatingfilm layer 8. The polycrystalline Si layer 6 is doped withhigh-concentration phosphorus. The film thicknesses of the four layersare preferably 10 nm, 5 nm, 45 nm and 10 nm, respectively. The gateelectrode 1 is connected to an upper wiring through a gate contact plug3. The structure of the gate contact portion is configured so that the Wgate contact plug 3 of the upper wiring passes through the NiSi layer 5,the polycrystalline Si layer 6 and the TiN layer 7 so as to come intocontact with the LaB₆ layer 18.

Although this embodiment shows the case where the upper wiring plug 3 ismade of W, a low-resistant metal material such as Al or Cu may be usedsuitably. In this case, a TiN film etc. may be used as a barrier film inorder to improve adherence between a metal barrier layer and the Sioxide film. Source-drain regions 10, which are n-type high-densityimpurity regions, are formed on the p-type semiconductor layer of thesilicon substrate to sandwich the laminated structure of the gateelectrode 1 and the gate insulating film layer 8 therebetween. A NiSilayer 5 is formed on each of the source-drain regions 10 to bring theupper electrode and the diffusing layer into contact with each other.The film thickness of the NiSi layer 5 located on the diffusing layer ispreferably equal to the film thickness of the NiSi layer 5 located onthe gate portion. W source-drain contacts 4 are connected to upperportions of the NiSi layers 5 located on the diffusing layers,respectively. Thus, an n-type MIS transistor is formed on the p-typesemiconductor layer of the silicon substrate. Although this embodimentshows the case where the lowermost layer of the gate electrode beingcontact with the gate insulating film layer 8 is made of LaB₆ having aneffective work function of about 3.8-4.0 eV, which is substantiallyequal to that of a heavily doped p-type polycrystalline Si gate, thelowermost layer may be made of a metal material having a work functionin accordance with a threshold voltage necessary for the technicalgeneration and purpose of each device. The TiN layer 7 is a reactionbarrier layer for suppressing a reaction in the interface between theLaB₆ layer 18 and the polycrystalline Si. At the same time, reduction inresistance can be achieved because TiN is lower in resistance thanpolycrystalline Si. Besides the TiN film, a material such as TaN, TiSiN,TiAlN, HfN, etc., which can form a reaction barrier layer with respectto metal and which can bear under an impurity activation heat treatmentat about 1000° C., may be used. An optimum barrier layer may be used inaccordance with the kind of the metal or metallic compound layer as thelower layer. A semiconductor layer such as a SiGe layer, a Ge layer, anSiC layer, etc. may be used as an intermediate layer of the gateelectrode structure. Besides NiSi, a layer of low-resistant metalsilicide, germano-silicide, germanide or carbide silicide may be used asthe uppermost NiSi layer 5 in accordance with the intermediatesemiconductor layer. As for the other device structure than the gateelectrode 1, a structure in accordance with the purpose of the devicemay be used in each generation without departing from the gist of theinvention.

Embodiment 5

FIG. 8 shows the semiconductor device according to a fifth embodiment ofthe invention.

A p-type impurity region (p-type well region 17) and an n-type impurityregion (n-type well region 16) are separately formed on a p-typesemiconductor layer of a silicon substrate. Both gate insulating filmlayers 8 are general thermally oxidized silicon film layers. Thethickness of each gate insulating film layer 8 is preferably 2 nm orless. A gate electrode 1 is formed on each gate insulating film layer 8.The structure of the gate electrode 1 formed on the p-type well region17 is configured so that an LaB₆ layer 18, a polycrystalline Si layer 6doped with high-concentration phosphorus and an NiSi layer 5 arelaminated successively on the thermally oxidized silicon film layer 8.On the other hand, the structure of the gate electrode 1 formed on then-type well region 16 is configured so that a PtGe layer 19, apolycrystalline Si layer 20 doped with high-concentration boron and anNiSi layer 5 are laminated successively on the thermally oxidizedsilicon film layer 8. Source-drain regions 10, which are n-typehigh-density impurity regions, are formed in the p-well to sandwich thegate insulating film layer 8 therebetween. NiSi layers, which arecontact electrodes, are formed on the source-drain regions 10,respectively. Thus, an n-type MIS transistor is fabricated in the p-typewell region 17. On the other hand, source-drain regions 21, which arep-type high-density impurity regions, are formed on the n-type wellregion 16 to sandwich the gate insulating film layer 8 therebetween.NiSi layers are formed on the source-drain regions 21, respectively inthe same manner as in the n-type MIS transistor. Thus, a p-type MIStransistor is fabricated in the n-type well region 16. The n-type MIStransistor and the p-type MIS transistor operate so as to becomplementary to each other, so that the two transistors form a CMISdevice. The contact shape of each transistor is provided in the samemanner as in the first embodiment, that is, the W gate contact plugs 3are connected to the LaB₆ layer 18 and the PtGe layer 19, which are ametallic compound layer as the lower layer.

According to this structure, the same effect as in the first embodimentcan be obtained to achieve a high-speed CMIS operation. The same effectcan be obtained also when the shape of the contact plug shown in thesecond or third embodiment is used. The shapes of the contact plugsshown in the second and third embodiments may be used in combination.FIG. 9 shows the effective work function of each of metals and metalliccompounds. The value of the work function is extracted fromcapacitance-voltage characteristic of an MIS capacitor having a gateelectrode made of each material. Variations in measured value are alsoshown together with the value of the work function. If the impurityconcentration of the well is constant, the threshold value of the MIStransistor can be decided on the basis of the effective work function ofthe gate electrode measured by this method. In this embodiment, LaB₆ andPtGe are used as the lower layers of the gate electrodes 1 being incontact with the gate insulating film layers 8 of the n-type MIS andp-type MIS transistors, respectively. As shown in FIG. 9, the effectivework function of LaB₆ is about 3.9 eV whereas the effective workfunction of PtGe is 5.2 eV. These values are coincident with theeffective work functions of n-type and p-type polycrystalline Si gatesfabricated by the existing technique. Accordingly, if these electrodematerials are used, the metal gate electrode technique can be introducedwithout change of design values of other portions in the CMIStransistor. Rare earth metal silicide, transition metal silicide,germanide (ErSi_(1.7), YSi₂, TaSi, ErGe_(1.7)), metal boride (HfB, TaB,TiB) or TaC is also suitable for the gate electrode material of ann-type MISFET. Metal carbide (TiC, TaC), precious metal silicide (PtSi,PdSi), metal nitride (TiN, TaN), metal germanide (NiGe, PtGe), Wcompound (WC, WB) or precious metal (Pt, Au, Ir, Ru, W) is also suitablefor the gate electrode material of a p-type MISFET. In the case of afully depletion type transistor represented by an SOI device having anembedded insulating film layer 22 as shown in FIG. 12, because theimpurity concentration of the channel region becomes low, a gateelectrode material having an effective work function value of about 4.6eV needs to be used for each of the n-type and p-type transistors inorder to optimize the threshold voltage of the transistor. Accordingly,in the case of a fully depletion type device, a material such as Ta,NiSi, Ta₂N, ZrC, WSi₂, TiN, TiC, etc. having an effective work functionnear 4.6 eV can be used for the lower layer of the gate electrode 1.Reduction in transistor operating threshold voltage has been requiredwith the advance of technical generation and with the advance ofreduction in source voltage. The required threshold of the transistoroperating voltage varies according to the purpose of the device.Accordingly, a metal or a metallic compound having an effective workfunction necessary for obtaining an optimum threshold may be selected inaccordance with each technical generation and the purpose of use of thedevice. The work function fundamentally takes a value specific to eachmaterial and can be decided uniquely. It is however known that the workfunction of a metal material varies according to the crystal face. It isgenerally known that, even in one material, the value of the effectivework function increases as the face index of the crystal face increases.For example, it is known that the work function of (100) face of copper(Cu) is 4.6 eV whereas the work function of (111) face of copper (Cu) is5.0 eV. Each value shown in FIG. 9 is an average of work functions inrespective face indices of each electrode material, which is formed by asputtering film-forming method so that large part of the electrodematerial is polycrystalline or amorphous. That is, the work function ofeven one material can be controlled to change from the value shown inFIG. 9 by about 0.4 eV at the most if the face index is controlled by anALD method. Moreover, because the work function also depends on thecrystal grain size, the controllable range of the work function of onematerial can be further widened. It is a matter of course thatcombination with these methods is effective.

Embodiment 6

FIG. 10 shows a sixth embodiment of the invention.

A p-type impurity region (p-type well region 17) and an n-type impurityregion (n-type well region 16) are separately formed on a p-typesemiconductor layer of a silicon substrate. Both gate insulating filmlayers 8 are general thermally oxidized silicon film layers. Thethickness of each gate insulating film layer 8 is preferably 2 nm orless. A gate electrode 1 is formed on each gate insulating film layer 8.The structure of the gate electrode 1 formed on the p-type well region17 is configured so that a TiN layer 7, a polycrystalline Si layer 6doped with high-concentration phosphorus and an NiSi layer 5 arelaminated successively on the thermally oxidized silicon film layer 8.On the other hand, the structure of the gate electrode 1 formed on then-type well region 16 is configured so that a TiN layer 7, apolycrystalline Si layer 20 doped with high-concentration boron and anNiSi layer 5 are laminated successively on the thermally oxidizedsilicon film layer 8. The thickness of TiN in each conduction type wellregion is preferably 1 nm or less. Source-drain regions 10, which aren-type high-density impurity regions, are formed in the p-well tosandwich the gate insulating film layer 8 therebetween. NiSi layers,which are contact electrodes, are formed on the source-drain regions 10,respectively. Thus, an n-type MIS transistor is fabricated in the p-typewell region 17. On the other hand, source-drain regions 21, which arep-type high-density impurity regions, are formed on the n-type wellregion 16 to sandwich the gate insulating film layer 8 therebetween.NiSi layers are formed on the source-drain regions 21, respectively, inthe same manner as in the n-type MIS transistor. Thus, a p-type MIStransistor is fabricated in the n-type well region. The n-type MIStransistor and the p-type MIS transistor operate so as to becomplementary to each other, so that the two transistors form a CMISdevice. The contact shape of each transistor is configured so that the Wgate contact plugs are connected to the LaB₆ layer 18 and the PtGe layer19, which are a metallic compound layer as the lower layer, in the samemanner as in the first embodiment.

According to this structure, the same effect as in the first embodimentcan be obtained to achieve a high-speed CMIS operation. The same effectcan be obtained also when the shape of the contact plug shown in thesecond or third embodiment is used. The shapes of the contact plugsshown in the second and third embodiments may be used in combination.FIG. 11 shows TiN film thickness dependence of the effective workfunction of the TiN thin film/polycrystalline. Si laminated gateelectrode. If the thickness of the TiN layer, which is the lower layer,is not larger than 10 nm, the effective work function is affected by thework function of the polycrystalline Si electrode, which is the upperlayer. Therefore, the effective work function continuously approachesthe effective work function of each of the n-type polycrystalline Sielectrode and the p-type polycrystalline Si electrode, as the thicknessof the TiN film is reduced. In the embodiment shown in FIG. 9, the workfunction in the n-type MIS transistor approaches the effective workfunction of the n-type polycrystalline Si whereas the work function inthe p-type MIS transistor approaches the effective work function of thep-type polycrystalline Si. Therefore, if the thickness of the TiN filmis reduced to about 1 nm, the threshold value of the transistor can becontrolled by the work function of the polycrystalline Si, which is theupper layer. Moreover, if the TiN layer 7 is 0.5 nm thick, depletion ofthe gate can be suppressed so perfectly that the metal gate electrodetechnique can be introduced easily. As described above in the fifthembodiment, the required effective work function varies according toeach technical generation and the purpose of the device. When thethickness of the TiN film is controlled to be in a range of from 0.5 nmto 1.0 nm or when an interfacial metal layer near the valence band orconduction band of Si is used instead of TiN, the threshold value of thetransistor can be controlled easily in accordance with variation in therequired effective work function.

Although the first to sixth embodiments of the invention show the casewhere Si is used in the channel region, SiGe, Ge, distorted Si, etc.larger in mobility than Si may be used. Also, each embodiment may beapplied to a three-dimensional structure device represented by FinFETand to a fully depletion type device. Various changes may be made on theinvention without departing from the gist of the invention.

Various changes as described in the aforementioned embodiments can bemade on this embodiment while the same effect can be obtained.

1. A method for manufacturing a semiconductor device, comprising:forming an element separation insulating film layer in a semiconductorsubstrate so as to define a semiconductor layer on the semiconductorsubstrate; forming a gate electrode including: a gate insulating filmformed on the semiconductor layer, a metal or a metallic compound formedon the gate insulating film, a polycrystalline silicon layer formed onthe metal or the metallic compound, and a metal silicide formed on thepolycrystalline silicon layer; forming a source region and a drainregion in the semiconductor layer so as to sandwich the gate electrodetherebetween; and forming a plug that passes through the metal silicideand the polycrystalline silicon layer and that contacts with the metalor the metallic compound of the gate electrode.
 2. The method accordingto claim 1, wherein the forming the plug includes: forming a plug bottomportion that is formed of a metal silicide material, and forming a plugupper portion that is formed on the plug bottom portion and formed of ametal material.
 3. The method according to claim 1, wherein the gateelectrode includes a metal nitride film between the metal or themetallic compound and the polycrystalline silicon layer.
 4. A method formanufacturing a fully depletion type transistor, comprising: forming asemiconductor device by performing the method according to claim 1; andforming an embedded insulating layer in the semiconductor substrate,wherein the metal or the metallic compound mainly includes one selectedfrom the group consisting of Ta, NiSi, Ta₂N, ZrC, WSi₂, TIN, and TiC. 5.The method according to claim 1, wherein, in the forming the plug, theplug is formed over the element separation insulating film layer.
 6. Amethod for manufacturing a complementary transistor, comprising: formingan n-type MIS transistor including a semiconductor device by performingthe method according to claim 1, in which the source region and thedrain region are of n type; and forming a p-type MIS transistorincluding a semiconductor device by performing the method according toclaim 1, in which the source and the drain region are of p type.
 7. Themethod according to claim 6, wherein a thickness of the metal ormetallic compound in each of the MIS transistors is equal to or lessthan 10 nm.
 8. The method according to claim 6, wherein: the metal orthe metallic compound in the n-type MIS transistor includes one selectedfrom the group consisting of a rare earth metal silicide, a transitionmetal silicide, a germanide, a metal boride, and TaC, and the metal orthe metallic compound in the p-type MIS transistor includes one selectedfrom the group consisting of a metal carbide, a precious metal silicide,a metal nitride, a metal germanide, a W compound, and a precious metal.9. The method according to claim 8, wherein: the rare earth metalsilicide, the transition metal silicide and the germanide include mainlyone selected from the group consisting of ErSi_(1.7), YSi₂, TaSi, andErGe_(1.7), the metal boride includes mainly one selected from the groupconsisting of HfB, TaB, and TiB, the metal carbide includes mainly oneselected from the group consisting of TiC and TaC, the precious metalsilicide includes mainly one selected from the group consisting of PtSiand PdSi, the metal nitride includes mainly one selected from the groupconsisting of TiN and TaN, the metal germanide includes mainly oneselected from the group consisting of NiGe and PtGe, the W compoundincludes mainly one selected from the group of WC and WB, and theprecious metal includes mainly one selected from the group consisting ofPt, Au, Ir, Ru, and W.